The Wide World of Adhesion (el. knyga) (skaityta knyga) | knygos.lt

Aprašymas

Packed with cutting-edge insights from leading experts, this celebratory work honoring Dr. Kash Mittal, is an essential guide for anyone looking to master both temporary and permanent bonding to drive the next generation of adhesive innovations.

In the broad field of materials, there are many cases where two or more materials are bonded together to achieve properties that cannot be obtained from any single material. While in most cases these materials need to be bonded to each other permanently, in a few cases they need to be bonded temporarily so that they can be separated easily when needed. This volume, celebrating the 80th birthday of Dr. Kash Mittal, is an extension of the discussions at the 2022 meeting of the American Chemical Society. It covers a wide range of topics in the field of adhesion, such as dermatological applications, the role of surface topography in engineering interfacial adhesion, and critical adhesion in color cosmetics. With expert insights and informative illustrations, this volume serves as an essential guide for anyone looking to innovate the next generation of adhesive technology.

Readers will find the volume:

• Provides in-depth discussions on various critical aspects of adhesion science and technology;
• Discusses various aspects of wettability and how the theory can be applied in varying applications such as flow through porous media and release of active substances from ointments;
• Shows how plasma technology can be used to improve polymer adhesion and how substrate surfaces can be engineered to promote adhesion;
• Demonstrates the multi-industry flexibility of adhesives for a wide range of applications, presented in three parts.

Audience

Academics, industry and government laboratories, and researchers interested in bonding, packaging, printing, composite materials, and construction for the automotive, aerospace, polymer composites, cosmetics, biomedical materials, and fiber manufacturing industries.